With the rapid development of the switching power supply industry, its products are gradually moving towards miniaturization, high frequency and high power density. These development trends have produced more stringent requirements for the heat dissipation performance of switching power supplies. What are the reasons for the difference in heat dissipation performance of pfc power supply? do you know?
First, the length of the heatsink fins can cause differences in heat dissipation performance. It is generally believed that when the ratio of the degree of fins to the width of the radiator is close to 1, the heat transfer effect is better.
Furthermore, the choice of the thickness of the heat sink fins will also affect the heat dissipation performance of the module. In order to ensure the hardness of the radiator fins and easy processing, the hardness of the fins should not be too thin. In engineering, the thickness of the radiator fins is generally specified at about ≥1mm.
In addition to the two points mentioned above, the number of heat sink fins will also affect the heat dissipation performance of the high-power switching power supply. Under the premise of normal operation of the module, as the number of fins increases, the junction temperature of the heat source will decrease. Therefore, engineers cannot blindly increase the number of fins.
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