PCBA reflow soldering is an indispensable production processing link in the SMD processing, reflow soldering will also affect the welding quality of the SMD processing. t reflow soldering process in PCBA factory is mainly used for processing and welding. reflow soldering oven So what is reflow soldering?
Reflow soldering is actually a heating circuit in the soldering oven that heats air or nitrogen to a high enough temperature and then blows it onto the board where the components have been attached, causing the solder on both sides of the components to melt and bond to the motherboard. This processing method can speed up the SMD soldering process to a degree unattainable by manual soldering, easily achieving mass production and PCBA effectively controlling processing costs.
In reflow soldering, the pads of the PCBA substrate are first covered with solder paste, typically a mixture of solder, small spheres and flux microbeads.
The solder paste is automatically printed through the empty spaces in the stencil so that the paste remains only on the terminals that need to be soldered to the device.
After the PCBA has been installed on the substrate T-patch parts, a pre-furnace quality check is carried out and boards confirmed to be of acceptable quality are placed on tracks, transferred to the reflow oven and raised to a temperature above the melting point of the solder in the reflow machine equipment. The solder is then returned to the terminals of the equipment and the board is cooled.
The biggest factor affecting reflow soldering is uneven heating. The main causes of uneven heating are differences in heat capacity or heat absorption, the effect of the edges of the conveyor belt or heater, the negative of the reflowed product, etc. In order to obtain good soldering results, constant practice is necessary.
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